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2013 Q4 Workshop on Integrated Circuits and Packaging EMC Technologies
date:2014-01-19
發佈單位：emc27支會原始連結
2013 Q4 Workshop on Integrated Circuits and Packaging EMC Technologies was successfully held at National Taiwan University on December 26, 2013. The conference was organized by IEEE EMC Taipei Chapter and Taiwan Electronics Testing Center (ETC) and co-sponsored by four other organizations: Yen Tjing Ling Industrial Research Institute, Taiwan Electromagnetic Industry-Academia Consortium, Communication Resear ch Center, and Graduate Institute of Communication Engineering (GICE) of National Taiwan University (NTU).
The purpose of this conference is to invite scholars and industry experts to share and exchange knowledge, experiences, and future trends in EMC-related fields. Included in the conference were five topics: integrated circuits and packaging EMC design, electromagnetic interference (EMI), EMC regulations and developments, EMC testing and measurement techniques, and ESD protection technology.