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Sep.29,
2014

Vol. 28
  • 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
    • Low power CMOS and embedded memory Foundry technology RF process, device and integration technology Stand alone memory: DRAM, FLASH, emerging memories Advanced CMOS modules: e.g; gate stack, strained Si, SiGe substrates, interconnect technology, etc. Lithography: directed self assembly, EUV, multiple patterning, etc. Power and analog IC device and technology Advanced CMOS: Ge, SiGe, III-V process and devices Process and device modeling TFT and organic electronics MEMS , imagers and sensors Advanced manufacturing technology, yield, reliability and test 3D ICs and advanced packaging Photonics Energy scavenging technology
  • 2014 20th IEEE International Conference on Parallel and Distributed Systems (ICPADS)
    • Established in 1992, ICPADS has been a major international forum for scientists, engineers, and users to exchange and share their experiences, new ideas, and latest research results on all aspects of parallel and distributed systems area. Contributions are solicited in all areas of parallel and distributed systems research and applications.
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